TN ODM FLOW |
No. |
Step |
Description |
Comments |
1 |
Technology Check |
Accept the Design file |
Protel/dxp,Orcad,Pads…… or you require us to design |
Dimension estimate |
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PCB Material |
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Layer |
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Thickness |
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Quantity |
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Process Time |
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Solder Mask Color |
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Others requirement |
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2 |
PCB Process |
Technology Preparing |
NC Drilling and mill,Cutting program |
Photo Film Process |
Each side protract the film |
Printing Mask |
Top&Bottom layer |
Standard Process |
Cut lamination,Hot Air Leveling… |
Gold plating |
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Silvering |
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Profile |
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Surface Faule Inspection |
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Final Inspection |
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Packaging |
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Others requirement |
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3 |
Components and parts procurement |
Agent to purchase the components and parts |
Details requirement will be discussed separately |
Components and parts testing |
Details requirement will be discussed separately |
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4 |
Assembly |
SMD Tin Plasm&steel mask |
Printing Tin Plasm |
SMD Device Assembly |
Over Reflow Soldering, lead-free reflow oven |
Through Hole Device Assembly |
Plut-in and Wave Soldering,lead-free soldering system |
Others requirement |
e.g. paste the protective gluewater, screw fixed etc. |
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5 |
Finished goods PCB testing |
Exterior inspection |
Standard exterior inspection |
Electrified testing |
Customers supply the testing flow, details requirement will be discussed separately |
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6 |
Combination |
Case |
Screw fixed |
Components |
Spot glue or others components |
Others requirement |
Special requirement will be discussed separately |
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7 |
Overall machine testing |
Overall machine testing |
According to customer craft requirement to test |
8 |
Packaging and Delivery |
Plastic bag |
Normal or static-free, size , whether or not one-time plastic packaging |
Foam and damping material |
Details requirement will be discussed separately |
Cartons |
Details requirement will be discussed separately |
Introduction |
Details requirement will be discussed separately |
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