PCB Manufacturing Capabilities |
| Item |
Parameter (Technical data) |
Remark |
Layer |
1~18 |
|
Max making-up size |
32"*20"(800mm*508mm) |
|
Surface treatment technique |
HASL, Immersion Tin, Immersion Gold/ENIG, Gold Plated,Gold Finger, OSP,BGA |
|
Min inner line width/ line space |
4mil/4mil(0.1mm/0.1mm) |
≥8layer,0.15mm |
Min inner layer bonding pad |
5mil(0.13mm) |
Finger Annular ring width |
Min inner layer thickness |
4mil(0.1mm) |
|
Inner layer copper foil thickness |
1/2oz(17um) |
Without copper foil |
Outer layer bottom copper thickness |
1/2oz(17um) |
|
Finished board thickness |
0.20-4.0mm |
|
Finished board thickness tolerance |
Board thickness<10mm |
±12% |
4-8layers |
1.0mm≤board thickness <2.0mm |
±8% |
4-8layers |
±10% |
≥10layers |
Board thickness≥2.0mm |
±10% |
|
Inner surface treatment technique |
Brown Oxide |
|
Multi-layer plywood accuracy |
±3mil(±76um) |
|
Min drilling diameter |
0.15mm |
|
Min finished diameter |
0.10mm |
|
Hole site precision |
±2mil(±50um) |
|
Slotted hole tolerance |
±3mil(±75um) |
|
Plated through hole bore tolerance |
±2mil(±50um) |
|
Non-plated through hole bore tolerance |
±1mil(±25um) |
|
Max plated through hole aspect ratio |
10:01 |
|
Copper thickness for hole wall |
0.4-2mil(10-50um) |
|
Outer round para precision |
±3mil(0.075um) |
|
Min outer line width/ space |
3mil/3mil(75um/75um) |
|
Carving tolerance |
±1mil(±25um) |
|
Solder mask thickness |
Top line |
0.4-1.2mil(10-30um) |
|
Line corner |
≥0.2mil(5um) |
|
Parent material |
1 |
|
Solder mask hardness |
6H |
|
Solder mask round para precision |
±2mil(±50um) |
|
Solder mask min width |
3.0mil(75um) |
|
Max bore of oil plug |
0.8mm |
|
Max nickelage thickness of gold finger |
280u"(7um) |
|
Max nickel plus gold plating thickness of gold finger |
60u"(1.5um) |
|
Thickness range for gold plating |
120u"/240u"(3um/6um) |
|
Thickness range for nickel and gold plating |
2u"/6u"(0.053um/0.15um) |
|
Controlled impedance and tolerance |
50o±10% |
|
Wire peel strength |
≥61B/in(≥107g/mm) |
|
Angularity |
≤0.5% |
|
